Markets / Semiconductor Capital Equipment

Semiconductor Capital Equipment

​For the semiconductor manufacturing market, our ultra-stable, large area, reaction bonded silicon carbide wafer chucks handle increasingly larger wafer sizes required for advanced device fabrication. Our polycrystalline CVD diamond windows and components are capable of handling high powers for next generation, extreme ultraviolet lithography systems.

FEOL Photolithography

Front end of line (FEOL) semiconductor equipment manufacturers continue to allocate more resources and increase investments to push the limits of wafer processing with proprietary designs that increase manufacturing throughput and yields. Extreme ultraviolet (EUV) lithography is an emerging technology that shrinks circuit features of silicon microelectronics down 7 nm or less. This technology requires specially designed wafer tables that are extremely flat to successfully process wafers through EUV lithography. II-VI’s products based on reaction bonded silicon carbide (RB SiC) meet the very tight flatness tolerances that are required to achieve the EUV lithography throughput requirements and yield targets that FEOL equipment manufacturers require.

MEOL Inspection and Testing

​As wafers get thinner and devices get smaller, middle end of line (MEOL) semiconductor equipment manufacturers require new wafer clamping solutions and more precise wafer location referencing capabilities. II-VI’s products based on reaction bonded silicon carbide (RB SiC) meet very tight flatness tolerances and perfectly match the coefficient of thermal expansion (CTE) of silicon wafers. These II-VI engineered materials enable MEOL equipment manufacturers to design state of the art wafer chucks and stage components that achieve very high throughput requirements for wafer inspection and test.

BEOL Dicing Packaging & Test

Back end of line (BEOL) semiconductor equipment manufacturers continue to increase the speed of wafer probing, wafer dicing, chip to wafer bonding and wire bonding. As the wafer stages move at higher speed, semiconductor equipment manufacturers require new materials that reduce the effects of vibration and transient thermal dissipation from motorized assemblies. II-VI’s metal matrix composite products are ideal for casting parts that feature tight tolerances, high surface flatness, high stiffness, high thermal conductivity and low weight. These II-VI engineered materials enable BEOL equipment to operate at high speeds with high mechanical accuracy, insuring high yields.