Reaction Bonded SiC
Coherent’s SiC-based composites offer a broad range of solutions:
- Superior flatness capabilities – We are able to provide the semiconductor industry superior flatness capabilities that allow our customer’s tools to meet the decreasing dimensions required for the electrical circuits that power our lives.
- Size and shape flexibility – Coherent’s advanced forming techniques allow for the manufacture of large, complex shapes with minimal or no machining. Components measuring up to 60” x 60” and weighing 1000 lbs have been produced. Typical products include, but are not limited to, burner nozzles, conical diffusers, coal deflectors, jet mill liners, and burner elbows.
- Infiltration depth – Our reaction-bonding process can fully infiltrate components as thick as 6”, allowing a greater volume of wear material for harsh environments.
- Reduced weight – Silicon Carbide components will be significantly lighter than the carbide, ceramic, or metal parts they will be replacing, easing installation and reducing downtime.
Material Flexibility
Coherent is pleased to offer multiple core material options within the reaction-bonded ceramic family. Additionally, our well staffed R&D group have the ability to tailor compositions to meet the most demanding application needs. We have won several R&D awards over the years for our innovative products.
Flow-through channels – In addition to material technology, Coherent has expert process knowledge including the unique ability to create internal flow-through channels. This is ideal for air/vacuum distribution applications, as well as thermal management control in high heat applications such as high energy lasers, semi-conductor processes, or heat-exchangers.
High Thermal Conductivity SiSiC
The unique thermal and mechanical properties of reaction-bonded silicon/silicon carbide (RB-SiSiC) make itideally suited for thermal management applications including for high-voltage power supplies, electric vehicles, inverters for green energy, industrial motor drives, smart-grids, and wireless base stations. Advanced high power modules require faster and better heat dissipation. Coherent’s new RB-SiSiC materials achieve over 255 W/m-K of thermal conductivity, while maintaining the same mechanical properties as other RB-SiSiC materials in its family.
| Property | SSC-702 | SSC-802 | SSC-902 | SSC-FG | HSC-702 | TSC-15 | RBBC-751 |
|---|---|---|---|---|---|---|---|
| (Fine Grained SiSiC) | (Si/SiC+Al) | (Si/SiC + Ti) | (B4C/SiC/Si) | ||||
| Poisson’s Ratio | 0.18 | 0.18 | 0.18 | 0.18 | 0.19 | 0.19 | 0.18 |
| Young’s Modulus (GPa) [E] | 350 | 380 | 410 | 330 | 330 | 390 | 400 |
| CTE, 20-100ºC (ppm/K) [α] | 2.9 | 2.9 | 2.7 | 3 | 4.4 | 3 | 4.8 |
| Thermal Cond. (W/m-K) [k] | 170 | 180 | 190 | 150 | 200 | 210 | 52 |
| SpecificHeat (J/kg-K) | 680 | 670 | 660 | 680 | 700 | 670 | 890 |
| Ult. Tensile Strength (MPa) | N/A | N/A | N/A | N/A | N/A | N/A | N/A |
| Flexural Strength (MPa) | 270 | 280 | 280 | 350 | 275 | 225 | 280 |
| Fracture Toughness (Mpa-m1/2) | 4 | 4 | 4 | 4 | 5 | 5 | 5 |
| Damping Factor (% Zeta) | 0.12 | ||||||
| Specific Stiffness (E/ρ) | 119 | 127 | 131 | 112 | 109 | 125 | 156 |
| Thermal Stability (k/α) | 59 | 62 | 70 | 50 | 45 | 70 | 11 |