Metal Matrix Composites

II-VI manufactures metal matrix composites using unique, patented forming techniques. MMCs have been used for years in applications that require high stiffness and low density, essentially approaching the stiffness of steel while maintaining the density of aluminum. These materials offer high thermal conductivity and tailorable coefficient of thermal expansion (CTE). Precision equipment components, thermal management base plates, mirrors, optical housings are just a few of the applications where MMCs have been successful.

Breakthrough Technology
II-VI maintains process capabilities that allow highly-loaded MMCs into large structures, without using expensive forming processes. For precision equipment applications, we currently cast structures over 2 meters by 2 meters. Our ability to cast complex structures to tight dimensional tolerances also allows final machining to be minimized.

COGENTUM technology provides equipment designers with unparalleled flexibility to improve Semiconductor equipment performance and meet the challenges of advanced Integrated circuit processing and packaging technologies. Incorporating II-VI’s engineered materials expertise and advanced processing methods the COGENTUM product family represents the next step forward in technology and expands our portfolio of product solutions for high performance machine design. COGENTUM products are currently available in a wide range of customer specified configurations.

Enabling Technology For High Performance System Accuracy
Manufacturers of advanced back end semiconductor processing equipment are focused on providing their customers with innovative, high performance and cost effective solutions to maintain leading edge and competitive market positions. To maintain a technical leadership position, system accuracy and precision are critical aspects of any advanced machine design.

Enabling Technology For High Throughput Systems
Manufacturers of advanced back end semiconductor processing equipment are focused on providing their customers with innovative, high performance and cost effective solutions to maintain leading edge and competitive market positions. Throughput is a critical aspect of advanced machine design, enabling technically advanced systems and an attractive return on investment (ROI). The COGENTUM Product line of advanced materials provides designers with the flexibility to optimize the mission critical components that are key to maximizing throughput for advanced machine performance.

Enabling Technology For Thermal Management In High Performance Systems
Manufacturers of advanced back end semiconductor processing equipment are focused on providing their customers with innovative, high performance and cost effective solutions to maintain leading edge and competitive market positions. Advanced high performance machines are typically subject to local thermal loads caused by high speed linear motors and various processing conditions such as wire, flip chip and thermo compression bonding. The stability of components and sub-systems adjacent to these heat sources can be negatively affected by thermal loads resulting in an overall loss in system performance. The COGENTUM Product line of advanced materials provides designers with expanded flexibility to manage thermal effects on critical components and structures. This is a critical aspect of advanced machine design when dimensional stability is key to Accurate, High Throughput, High Performance systems.

COGENTUM Brochure

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