eM15 – Monocrystalline Diamond Cutting

Laser cutting systems for natural and synthetic monocrystalline diamond and CVD wafers.  The diode-pumped green laser source and proprietary cutting method allow deep cuts with low taper and fine surface.

Laser source

Laser Type (Diode pumped)

Solid State Laser

Wavelength (nm)

532

Max Power (W)

15


Working area

X Y table

200 x 200

Max traverse speed (mm/min)

2000

Z axis (mm)

<150

*Rotation axis optional for 4, and 5 axis configuration


Software & control

Control board

3,4,5 axis coordinated motion

Processing software

II-VI eMicro

Laser path program

II-VI ePath

Monitoring

Coaxial video, machine vision alignment

Focusing

Visual through camera


Utilities

Connection Power (VA)

4000

Operating Voltage (V)

220

Exhaustion size (W/D/H mm) /weight

450/600/600 (40Kg)

Automatic Loading

According to customer requirement


Axis configuration

 

4, 5 axis

3 axis

Machine size (W/D/H  mm)

1300/2050/1800

1200/1950/1770

Machine Weight (kg)

1200

850

Fixture area (XxY) (mm)

D50x100

150×150

Target material

Synthetic and natural diamond cutting

Typical application

Shaped cutting

Normal cutting

 

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