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Laser Cutting

II-VI super hard materials laser processing system is an efficient tool to cut all kinds of super hard materials such as PCD, CVD and single crystal diamonds, PDC, PCBN, ceramics etc. Compared with traditional EDM, II-VI laser systems can cut non-conductive materials, are easy to program and can start cuts from any location.

II-VI specially design, manufacture and market laser cutting and drilling machines for processing of all kinds of super hard materials (PCD and CVD diamond, PDC, PCBN, ceramics).

PCD
Model Thickness Passes Cutting Speed Kerf
LPC11 1.6mm 1 0.7mm/s 0.12mm
2mm 1 0.45mm/s 0.12mm
LPC12 1.6mm 1 1.8mm/s 0.14mm<
2mm 1 1mm/s 0.14mm<
LCP80N 1.6mm 1 2.5mm/s 0.16mm<
2mm 1 1.4mm/s 0.16mm<

 

PCBN
Model Thickness Passes Cutting Speed Kerf
LPC12 4.76mm 1 0.4mm/s 0.2mm
LCP80N 4.76mm 1 >0.5mm/s 0.2mm

 

Sapphire
Model Thickness Passes Cutting Speed Kerf
LPC11 0.3mm 1 2mm/s 0.12mm
LPC12 0.3mm 1 6mm/s 0.15mm

 

PDC
Model Model Passes Cutting Speed Kerf
LCP80N 1304 1 0.5mm/s 0.18mm<
1308 3 0.9mm/s 0.20mm

 

Carbide
Model Thickness Passes Cutting Speed Kerf
LPC12 2.0mm 1 1.2mm/s 0.15mm
LPC80N 2.0mm 1 1.5mm/s 0.18mm

 

CVD
Model Thickness Passes Cutting Speed Kerf
LPC12 1.0mm 1 0.6mm/s 0.14mm
LPC80N 1.0mm 1 0.8mm/s 0.15mm

LPC11
Medium laser power, very good beam quality, for high quality cutting of thin materials (2.0mm max).

Suitable for CVD, PCD, ceramics, monodiamond.

LPC12

Medium high power, good beam quality, for quality cutting of materials up to 5mm.
Suitable for PCD, CBN, PCBN, ceramics and monodiamond.

The laser is also available in drilling version for PCD and PCBN hole drilling.

LPC80N

High laser power for cutting all thickness and materials. Quality laser beam under medium laser power.

 

 

Laser Drilling

II-VI super hard materials laser processing system is an efficient tool to drill all kinds of super hard materials such as PCD, CVD and single crystal diamonds, PDC, PCBN, ceramics etc. Compared with traditional EDM, LASERTECH laser systems can cut non-conductive materials, are easy to program and can start cuts from any location.

II-VI specially design, manufacture and market laser cutting and drilling machines for processing of all kinds of super hard materials (PCD and CVD diamond, PDC, PCBN, ceramics).

 

PCD
Model Thickness Passes Cutting Speed Kerf
LPC12 4.8mm 8 0.1mm/s N/A
LPC40N 2.0mm 8 0.2mm/s N/A

 

PCBN
Model Thickness Passes Cutting Speed Kerf
LPC12 4.8mm 6 0.2mm/s N/A

 

Alumina Ceramics
Model Thickness Passes Cutting Speed Kerf
LPC12 1.0mm 2 1.0mm/s N/A
Micromachining

II-VI super hard materials laser processing system is an efficient tool to groove all kinds of super hard materials such as PCD, CVD and single crystal diamonds, PDC, PCBN, ceramics etc. Compared with traditional EDM, II-VI laser systems can cut non-conductive materials, are easy to program and can start cuts from any location.

II-VI specially design, manufacture and market laser cutting and drilling machines for processing of all kinds of super hard materials (PCD and CVD diamond, PDC, PCBN, ceramics).

 

eM30 Micromachining Laser
Application Chip breaker, Rough Edge Finishing
Laser Power 30W Max
Installed Axes 3 Mechanical + 2 Optical
Alignment Method Coaxial video, 10um
Target Materials PCD, CBN, CVD etc
Material Removal Rate 1-10um per Layer
Laser Cutting
II-VI super hard materials laser processing system is an efficient tool to cut all kinds of super hard materials such as PCD, CVD and single crystal diamonds, PDC, PCBN, ceramics etc. Compared with traditional EDM, II-VI las... Read More
Laser Drilling
II-VI super hard materials laser processing system is an efficient tool to drill all kinds of super hard materials such as PCD, CVD and single crystal diamonds, PDC, PCBN, ceramics etc. Compared with traditional EDM, LASERTE... Read More
Micromachining
II-VI super hard materials laser processing system is an efficient tool to groove all kinds of super hard materials such as PCD, CVD and single crystal diamonds, PDC, PCBN, ceramics etc. Compared with traditional EDM, II-VI... Read More
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