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CogentuM

COGENTUM™ technology provides equipment designers with unparalleled flexibility to improve Semiconductor equipment performance and meet the challenges of advanced Integrated circuit processing and packaging technologies.

Incorporating II-VI’s engineered materials expertise and advanced processing methods the Cogentum product family represents the next step forward in technology and expands our portfolio of product solutions for high performance machine design.

“As the Semiconductor Industry continues its pursuit of Moore’s Law, increased emphasis is placed on traditional and advanced back end of line processing equipment to produce integrated device packages with smaller form factors, greater complexity and improved energy efficiency. The COGENTUM™ product family of advanced materials supports the industry by enabling higher throughput, enhancing stability and precision, and delivering lower cost of ownership to manufacturers of advanced back end IC manufacturing equipment.”

“We are very pleased to introduce CogentuM™ as the latest addition to our existing portfolio of advanced products,” added II-VI M Cubed Technologies General Manager, Brian Monti. “Leveraging our expertise in front end IC manufacturing equipment with our global manufacturing base, COGENTUM™ technology is well positioned to meet the equipment challenges of the emerging high growth market for advanced back end IC processing systems”

COGENTUM™ products are currently available in a wide range of customer specified configurations.

Reaction Bonded Ceramics

II-VI’s SiC-based composites offer a broad range of solutions for harsh process applications.

  • Superior flatness capabilities – We are able to provide the semiconductor industry superior flatness capabilities that allow our customer’s tools to meet the decreasing dimensions required for the electrical circuits that power our lives.
  • Size and shape flexibility – M Cubed Technologies’ advanced forming techniques allows for the manufacture of large, complex shapes with minimal or no machining. Components measuring up to 60” x 60” and weighing 1000 lbs have been produced. Typical products include, but are not limited to, burner nozzles, conical diffusers, coal deflectors, jet mill liners, and burner elbows.
  • Infiltration depth – Our reaction-bonding process can fully infiltrate components as thick as 6”, allowing a greater volume of wear material for harsh environments.
  • Reduced weight – Silicon Carbide components will be significantly lighter than the carbide, ceramic, or metal parts they will be replacing, easing installation and reducing downtime.

M Cubed’s engineers have developed multiple new compositions within the reaction-bonded ceramic family.  Compositions can be tailored to meet the application need, including the fabrication of ceramic composites. We are constantly working on new applications and new materials with our well staffed R&D group. We have won several R&D awards over the years for our innovative products.

Flow-through channels– One of these unique, patented specialty materials is a RBSC composite that is engineered to allow the addition of flow-through channels,  ideal for critical thermal management in high heat applications required by high energy lasers, semi-conductor applications and heat-exchanger applications.

Reaction Bonded Silicon Carbide

II-VI, the high power CO2 and Fiber laser solution center is once again bringing you the next generation of high power laser optical materials. In collaboration with our wholly owned subsidiary M Cubed Technologies, II-VI is working to develop materials tailored for the future of high power laser processing. Engineered materials such as Reaction Bonded SiC (RB SiC) and Reaction Bonded SiC + Diamond (RB SiC + Diamond) combine all of the best material properties of traditional mirror materials into one optimized material solution.

Advantages of RB SiC over traditional high power mirror materials:

  • Coefficient of thermal expansion 5x lower than copper reduces the deformation of the optical surface due to the thermal load.
  • Density 3x lower than copper reduces the weight of the mirror and allows for use in cutting heads that require fast movement of the head.
  • Ability to add internal water cooling channels gives it an advantage over Si mirrors.
  • Ability to directly polish with roughness < 40Å and coated with any II-VI high reflector coating.

Reaction Bonded SiC + Diamond

If even greater thermal load handling capability is required RB SiC + Diamond could be the answer. With a CTE similar to CVD Diamond and a Thermal Conductivity greater than any traditional metal substrate SiC + Diamond is the ideal material for high thermal loads.

Advantages of RB SiC + Diamond :

  • Potential to achieve a coefficient of thermal expansion nearly 14x superior to copper with a thermal conductivity that is 1.6x higher.
  • Ability to create internal water cooling structures similar to RB SiC
  • Ability to directly polish with roughness < 40Å and coated with any II-VI high reflector coating.

Materials Stability Chart

Materials Properties

Material properties of RB SiC vs. standard mirror materials

Material Density (g/cc)

Young’s Modulus (GPa)

Thermal Cond. (W/mK)

CTE
(ppm/K at RT)

RB SiC

2.95

344

151

2.9

Copper

8.96

117

390

16.7

Silicon

2.33

131

156

2.6

Aluminum

2.7

69

167

22.5

Material properties of RB SiC vs. standard mirror materials 

Material properties of Reaction Bonded SiC + Diamond

Formulation Density (g/cc)

Young’s Modulus (GPa)

Thermal Cond. (W/mK)

CTE
(ppm/K at RT)

RB SiC

2.95

344

151

2.9

RB SiC + Diamond -1.8

3.17

485

280

1.8

RB SiC + Diamond -1.5

3.23

545

430

1.5

RB SiC + Diamond -1.2

3.33

700

620

1.2

Material properties of Reaction Bonded SiC + Diamond

CogentuM
COGENTUM™ technology provides equipment designers with unparalleled flexibility to improve Semiconductor equipment performance and meet the challenges of advanced Integrated circuit processing and packaging technologies. Incorporating II... Read More
Reaction Bonded Ceramics
II-VI’s SiC-based composites offer a broad range of solutions for harsh process applications. Superior flatness capabilities – We are able to provide the semiconductor industr... Read More
Reaction Bonded Silicon Carbide
II-VI, the high power CO2 and Fiber laser solution center is once again bringing you the next generation of high power laser optical materials. In collaboration with our wholly owned subsidiary M Cubed Technologies, II-VI is working to develop mat... Read More
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