II‐VI Incorporated (NASDAQ:IIVI), a leading provider of solutions for optical networks, today announced that in order to address increased demand for its differentiated product portfolio, it plans to expand the capacity of its 980 nm pump laser production lines, including wafer fab and chip on carrier assembly in Zurich, Switzerland and in Calamba, Philippines, and pump laser module assembly in Shenzhen, China.  The company has also completed the extension of the current facility lease in Shenzhen, China.

Specifically, II-VI will increase its production capacity to meet the strong demand for datacenter interconnects and the growing demand for ROADMs. This new production capacity is expected to be operational by the end of calendar year 2018.

“As our company has previously discussed, we are seeing increased demand for our products for optical communications,” said Simon Loten, General Manager, II-VI Pump Laser Division. “Our micro-pump lasers, one of our latest innovations, have set new standards in miniaturization, enabling transceiver embedded amplifiers for next generation datacenter interconnects.”

II-VI’s semiconductor laser chips are designed and manufactured in Zurich, Switzerland, leveraging a high reliability legacy that spans more than 20 years. II-VI’s manufacturing facility in Calamba, Philippines, houses state-of-the-art automated assembly lines for laser sub-assemblies which are shipped to II-VI operations in Shenzhen, China to complete the pump laser module assembly. II-VI’s Shenzhen operations shipped more than 3 million pump lasers, the majority of them under the II-VI brand.

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