Materials
Metal Matrix Composites
Improve the thermal stability of semiconductor processing equipment with materials that offer a unique mix of high specific stiffness and high thermal stability.
Coherent COGENTUM metal matrix technology provides designers with unparalleled flexibility to improve semiconductor equipment performance and meet the challenges of advanced Integrated circuit processing and packaging technologies.
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COGENTUM Properties
Choose from a range of composites which can be cast into structures over 2 meters by 2 meters in size.
Material Property |
CONGENTUM® Green |
CONGENTUM ® Blue |
CONGENTUM ® Gold |
Density (g/cc) [ρ] |
2.78 |
2.80 |
2.96 |
Poisson's Ratio |
0.29 |
0.29 |
0.25 |
Young’s Modulus - GPa [E] |
125 |
143 |
200 |
CTE avg 20-100ºC (ppm/K) [α] |
15 |
12 |
11 |
Thermal Conductivity (W/m-K) [k] |
160 |
164 |
160 |
Specific Heat (J/kg-K) |
820 |
800 |
730 |
Ultimate Tensile Strength (MPa) |
370 |
320 |
340 |
Fracture Toughness (MPa-m1/2) |
15 |
13 |
13 |
Damping Factor (% Zeta) |
0.26 |
0.26 |
0.58 |
Specific Stiffness (E/ρ) |
45 |
51 |
68 |
Thermal Stability (k/α) |
11 |
14 |
14 |
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