MEOL Inspection and Testing
Middle end of line (MEOL) semiconductor equipment manufacturers continue to allocate more resources and increase investments to push the limits of wafer inspection and test with proprietary designs that increase manufacturing throughput. As wafers get thinner and devices get smaller, semiconductor equipment manufacturers require new wafer clamping solutions and more precise wafer location referencing capabilities. II-VI’s products based on reaction bonded silicon carbide (RB SiC) meet very tight flatness tolerances and perfectly match the coefficient of thermal expansion (CTE) of silicon wafers. These II-VI engineered materials enable MEOL equipment manufacturers to design state of the art wafer chucks and stage components that achieve very high throughput requirements for wafer inspection and test.