Front end of line (FEOL) semiconductor equipment manufacturers continue to allocate more resources and increase investments to push the limits of wafer processing with proprietary designs that increase manufacturing throughput and yields. Extreme ultraviolet (EUV) lithography is an emerging technology that shrinks circuit features of silicon microelectronics down 7 nm or less. This technology requires specially designed wafer tables that are extremely flat to successfully process wafers through EUV lithography. II-VI’s products based on reaction bonded silicon carbide (RB SiC) meet the very tight flatness tolerances that are required to achieve the EUV lithography throughput requirements and yield targets that FEOL equipment manufacturers require.
Explore our products for FEOL applications: