BEOL Dicing Packaging & Test

BEOL Dicing Packaging & Test

Back end of line (BEOL) semiconductor equipment manufacturers continue to allocate more resources to increase the speed of wafer probing, wafer dicing, chip to wafer bonding and wire bonding, with proprietary designs. As the wafer stages move at higher speed, semiconductor equipment manufacturers require new materials that reduce the effects of vibration and transient thermal dissipation from motorized assemblies. II-VI’s Cogentum® series of metal matrix composite products are ideal for casting parts that feature tight tolerances, high surface flatness, high stiffness, high thermal conductivity and low weight. These II-VI engineered materials enable BEOL equipment to operate at high speeds with high mechanical accuracy, insuring high yields.
Explore our products for BEOL applications:
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